Revolutionizing Flux and Solder Paste Technology
Introducing the breakthrough innovation in flux and solder paste that eliminates cold storage requirements while maintaining superior performance
The Industry Challenge
With the rapid advancement of technology, the use of flux and solder paste has become increasingly widespread across various manufacturing sectors. However, traditional flux and solder paste products come with significant logistical and operational challenges.
Currently, the storage environment for most flux and solder paste products on the market requires strict temperature control between 2-10°C (35.6-50°F). This mandates that users of flux and solder paste invest in specialized refrigeration equipment, increasing both capital expenditure and operational costs.
Critical Temperature Requirements
Strict 2-10°C storage necessitates dedicated refrigeration systems
Time-Consuming Preparation
2-4 hour warming period required before use to prevent moisture condensation
Increased Operational Costs
Additional expenses for refrigeration, energy, and lost productivity
Traditional cold storage requirements for flux and solder paste create significant operational challenges
Our Revolutionary Innovation
Addressing the industry's challenges, our research team has developed a groundbreaking formulation that transforms how flux and solder paste are stored, transported, and used in manufacturing processes worldwide.
Room-Temperature Stable Flux and Solder Paste
Our proprietary formulation eliminates the need for cold storage, representing a paradigm shift in flux and solder paste technology. This innovation not only reduces operational costs but also improves production efficiency by eliminating waiting times for product warming.
The key breakthrough lies in our specially engineered flux composition that maintains stability at ambient temperatures while preserving, and even enhancing, the superior welding performance required in modern manufacturing.
No refrigeration required
Immediate use from storage
Superior welding performance
Key Benefits
- Eliminates cold storage infrastructure costs for flux and solder paste
- Reduces energy consumption associated with refrigeration
- Eliminates 2-4 hour waiting period for flux and solder paste to reach room temperature
- Prevents moisture condensation issues during application
- Improves production line efficiency and reduces downtime
- Enhances transportation flexibility for flux and solder paste
- Maintains or exceeds performance standards of traditional flux and solder paste
Advanced Formulation
Our innovative flux and solder paste technology is the result of extensive research into optimal material combinations that deliver both stability and performance.
Flux Composition
The proprietary flux formulation that enables our room-temperature stable flux and solder paste consists of carefully selected components in precise proportions:
- Rosin: 35-43% by weight, providing the base matrix for the flux
- Activators: 10-15% by weight, ensuring superior metal surface preparation
- Thixotropic agent: 6.5% by weight, providing optimal viscosity characteristics
- Corrosion inhibitor: 0.2% by weight, protecting metal surfaces post-welding
- Solvents: Remaining percentage, ensuring proper consistency and application properties
This precise formulation ensures that our flux and solder paste maintains stability at room temperature while delivering exceptional performance during the soldering process.
Component Breakdown
Rosin Components
Selected from high-quality options including:
- KE-604 rosin
- Fully hydrogenated rosin
- Disproportionated rosin
- White rosin
Activator System
Optimized blend including:
- Diethylaminoethanol hydrochloride
- Cetyltrimethylammonium bromide
- Adipic acid, salicylic acid
- Methylimidazole, diethylimidazole
Solvent System
Carefully selected solvents:
- Polyethylene glycol 400
- Propylene glycol methyl ether
- Tetrahydrofurfuryl alcohol
- Custom-blended solvent systems
Solder Paste Composition
Our revolutionary room-temperature stable solder paste combines our proprietary flux formulation with high-quality lead-free tin-silver-copper (SAC) alloy solder powder, creating a flux and solder paste system that delivers exceptional performance without cold storage requirements.
The optimal ratio of components in our flux and solder paste is carefully controlled to ensure both stability and performance:
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Flux component: 11.0-12.0% by weight
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Solder powder: 88.0-89.0% by weight
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Alloy system: Lead-free tin-silver-copper (SAC) formulations
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Powder particle size: 25-45μm for optimal printing and flow characteristics
Optimal particle distribution ensures consistent performance in our flux and solder paste
Proven Performance
Extensive testing and real-world applications have demonstrated that our innovative flux and solder paste outperforms traditional products in both stability and welding performance.
Exceptional Stability
Our flux and solder paste maintains stability for extended periods at room temperature, eliminating the need for cold storage.
Superior Weld Quality
The advanced formulation ensures strong, reliable joints with excellent wetting properties.
Enhanced Efficiency
Eliminating warming time reduces production line downtime and increases throughput.
Formulation Examples
Example Formulation 1
Flux Composition (by weight)
- KE-604 Rosin 25%
- Fully Hydrogenated Rosin 13%
- Diethylaminoethanol Hydrochloride 0.5%
- Adipic Acid 3%
- Salicylic Acid 5.4%
- Diethylimidazole 3%
- 12-Hydroxystearic Acid Amide 6.5%
- Benzotriazole 0.2%
- Polyethylene Glycol 400 12%
- Propylene Glycol Methyl Ether 31.4%
Solder Paste Specifications
- Solder Powder Alloy: SnAg3.0Cu0.5
- Particle Size: 25-45μm
- Flux Percentage: 11.6% by weight